Esashi M. 3D and Circuit Integration of MEMS 2021

Textbook in PDF format

MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Introduction
Overview
System on Chip
Bulk Micromachining
Enhanced Bulk Micromachining Based on MIS Process
Epitaxial Poly Si Surface Micromachining
Poly-SiGe Surface Micromachining
Metal Surface Micromachining
Heterogeneously Integrated Aluminum Nitride MEMS Resonators and Filters
MEMS Using CMOS Wafer
Wafer Transfer
Piezoelectric MEMS
Bonding, Sealing and Interconnection
Anodic Bonding
Direct Bonding
Metal Bonding
Reactive Bonding
Polymer Bonding
Soldering by Local Heating
Packaging, Sealing, and Interconnection
Vacuum Packaging
Buried Channels in Monolithic Si
Through-substrate Vias