Gan C. Electronic Materials Innovations...Reliability in Adv. Memory Packag.2025
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Gan C. Electronic Materials Innovations...Reliability in Adv. Memory Packag.2025
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Total size: 14.03 MB
Added: 6 months ago (2025-08-05 08:46:01)
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Info Hash: 5D38C38DFBCF3A912D5D25BBBC6C0918157B9B74
Last updated: 15 hours ago (2026-03-03 01:59:15)
Description:
Textbook in PDF format
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD)